1、 L X E S 0 3 A A A 1-1 5 4 polymeric ESD suppressor in a 0201 leadless ultra small Surface-Mounted Device(SMD)package help protect sensitive electronic equipment against electrostatic discharge(ESD)without distorting data signals.This protection is a result of its ultra-low capacitance of only 0.05
2、pF(I/O to GND),and it can be used to help equipment to pass IEC61000-4-2 level 4 test(15KV air,8KV contact discharge).The best ESD protection for high speed,lowvoltage applicationsRoHS compliant and halogen freeUltra low capacitance,0.05 pF(typ.)Low leakage current(10nA)Fast response time(1ns)Bi-dir
3、ectional,single line protection0201 Ultra small SMD packageSurface mount Smart Phone/Mobile Internet DeviceLaptop/Desktop ComputerAntennas(Cell Phones,GPS)High Speed EthernetUSB 2.0 and USB 3.0Lightning and Thunder Bolt InterfaceHigh Definition Multi-Media Interface(HDMI)Digital Visual Interface(DVI
4、)Display Port Interface(DP)Unified Display Interface(UDI)Mobile Display Digital Interface(MDDI)Caution:This component is designed for signal line protection only,not intended to be used on power lines or for power bus applications.DescriptionFeatures Applications RoHS Compliant Halogen Free 12Materi
5、als Information Equivalent Circuit Surface Mount Polymeric ESD SuppressorRev:01.06.20151/8 LXES03AAA1-154 Parameter Symbol Test Conditions Min.Typ.Max.Units Continuous Operating Voltage VDC-5 V Trigger Voltage VT IEC61000-4-2 8KV contact discharge-450-V Clamping Voltage VC IEC61000-4-2 8KV contact d
6、ischarge-40-V Leakage Current IL DC 5V shall be applied on component-10 nA Capacitance CP Measured at 10MHz-0.05-pF ESD Pulse Withstand Pulses IEC61000-4-2 8KV contact discharge 1000-Notes:Trigger and clamping voltage are measured per IEC 61000-4-2,8KV contact discharge method.Parameter Value Unit C
7、ontact Discharge Voltage Per IEC61000-4-2 8K V Air Discharge Voltage Per IEC61000-4-2 15K V Operating Temperature-55 to+125 Storage Temperature-40 to+85 General Characteristics Electrical Characteristics（TA=25 C）Rev:01.06.20152/8 LXES03AAA1-154Solder Heat Solderability Preconditioning Thermal Shock
8、Bias Humidity Test Test Conditions 1.150,4H;2.260,10s,1Times 245,5s 1.125,24H;2.85,85%RH,162H;3.260 Reflow,3 Times-55125,30min dwell,1000cycles85,85%RH,VDC,1000H Pass/Fail Criteria 90%Coverage 95%Coverage IL10nA IL10nA IL10nA Bias Heat Test Bias Low Temp Test Vibration Mechanical Shock Solvent Resis
9、tance Test Conditions 125,VDC,1000H-55,VDC,1000H10Hz-50Hz-10HZ,2hrs each in X-Y-Z axis 1500G,0.5ms,X-Y-Z axis 3 timesIPA,ultrasonic 300s Pass/Fail Criteria IL10nA IL10nA No Physical Damage IL10nA No Physical Damage IL10nA No Physical Damage IL10nA Typical ESD Response（IEC 61000-4-2,8KV contact disch
10、arge）Environmental SpecificationsRev:01.06.20153/8 LXES03AAA1-154-500 50 100 150 200 250 300 350 400 450 0 10 20 30 40 50 60 70 80 90 Voltage(V)Time（ns）00.010.020.030.040.050.061.0E+071.0E+081.0E+091.0E+10Capacitance(pF)Frequency(Hz)Typical Device Capacitance VS.FrequencyRev:01.06.20154/8 LXES03AAA1
11、-154 The PESD is designed for the protection of one bidirectional data line from ESD damage.Place the PESD as close to the input terminal or connector as possible.Minimize the path length between the PESD and the protected signal line.Use ground planes whenever possible.GNDSignal line to be protecte
12、d LXES03AAA1-154S USB 3.0Host/ControllerVbusD-D+GNDRX-RX+GNDTX-TX+USB PortESD Protection for Signal LineEye Diagram MeasurementUSB3.0 Mask at 5.0 Gbps HDMI Mask at 3.4 Gbps Rev:01.06.20155/8 LXES03AAA1-154*Sizes in mmDbL1eAL2EPackage outline 0.300.250.60Dimension Unit:Millimeters Min.Max.A 0.25 0.40
13、 b 0.15 0.20 D 0.50 0.70 E 0.25 0.35 e 0.45BSC L1 0.20 0.30 L2 0.00 0.05 Recommended Solder Pad Footprint Package DimensionRev:01.06.20156/8 LXES03AAA1-154Device Package Net Weight Carrier Quantity LXES03AAA1-1540201 0.12 mg Tape&Reel 15,000pcs/reel Taping SpecificationOrder InformationRev:01.06.201
14、57/8 LXES03AAA1-154Profile Feature Pb-Free Assembly Pre Heat Temperature Min(Tsmin)Temperature Max(Tsmax)Time(ts)from(Tsmin to Tsmax)150 C 200 C 60-120 secondsRamp-up Rate(TL to Tp)3 C/second max.Liquidus temperature(TL)Time(tL)maintained above TL 217 C 60-150 secondsPeak package body temperature(Tp
15、)260+0/-5 C Time(tp)*within 5 C of the specified classification temperature(Tc)30*seconds Ramp-down Rate(Tp to TL)6 C/second max.Time 25 C to peak temperature 8 minutes max.*Tolerance for peak profile temperature(Tp)is defined as a supplier minimum and a user maximum.Soldering Parameters Rev:01.06.20158/8 Shanghai Leiditech Electronic Co.,Ltd Email: Tel:+86-021 50828806 Fax:+86-021 50477059 LXES03AAA1-154
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