1812_LP-MSM075-33.pdf
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1、Features:RoHS Compliant Halogen Free faster tripping,1812 Dimension,Surface mountable,Solid state Operation Current:0.10A3.50A Maximum Voltage:6V60Vdc Operating Temperature:-40 TO 85 Product Dimensions Pig.1 Unit:mm Terminal pad materials:Tin-Plated Nickle-copper Terminal pad solderability:Meets EIA
2、 specification RS 186-9E and ANSI/J-STD-002 Category 3.Positive Thermal Coefficent Diodes LP-MSM075/33Rev: 01.06.20181/5Model No.A B C D E Min Max Min Max Min Max Min Min 4.37 4.73 3.07 3.41 0.50 1.20 0.30 0.15 Thermal Derating Chart-IH(A)Part number Maximum ambient operating temperatures()-40-20 0
3、25 40 5060 70 85 1.100.990.870.750.630.570.490.450.35Electrical CharacteristicModel No.Umax(Vdc)Imax(A)Ihold 25C(A)Itrip 25C(A)Time to trip R25 Current Time Rimin R1max(A)(Sec)()()24 100 0.75 1.50 8.0 0.20 0.090 0.450 LP-MSM075/33LP-MSM075/33LP-MSM075/33 Test Test Conditions Accept/Reject Criteria R
4、esistance In still air 25 RminRRmax Time to Trip Specified current,Vmax,25 Tmaximum Time to Trip Hold Current 30min,at IH No trip Trip Cycle Life Vmax,Imax,100cycles No arcing or burning Trip Endurance Vmax,1 hours No arcing or burning Physical Characteristics and Environmental Specifications Physic
5、al Characteristics Terminal materials:Tin-Plated Nickle-copper Soldering zone Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.Environmental Specifications Test Conditions Resistance Change Passive aging 85,1000hours 10%Humidity aging 85/85%RH.1000 hours 5%Thermal shock MIL-STD-202,Me
6、thod 107G +85/-40,20times-30%typical resistance change Solvent Resistance MIL-STD-202,Method 215 no change Vibration ML-STD-883C,Test Condition A No chage Electrical Specifications:Ihold=Hold Current.Maximum current device will not trip in 25 C still air.Itrip=Trip Current.Minimum current at which t
7、he device will always trip in 25 C still air.Vmax=Maximum operating voltage device can withstand without damage at rated current(Imax).Imax=Maximum fault current device can withstand without damage at rated voltage(Vmax).Pd=Maximum power dissipation when device is in the tripped state in 25 C still
8、air environment at rated voltage.Rimin/max=Minimum/Maximum device resistance prior to tripping at 25 C.R1max=Maximum device resistance is measured one hour post reflow.Test Procedures And Requirements Rev: 01.06.20182/5LP-MSM075/33 Solder reflow conditions Recommended reflow methods:IR,vapor phase o
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