IPC-2226高密度互连(HDI)印制板设计分标准(英文版).pdf
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1、IPC-2226Sectional Design Standardfor High Density Interconnect(HDI) Printed BoardsASSOCIATION CONNECTINGELECTRONICS INDUSTRIES2215 Sanders Road, Northbrook, IL 60062-6135Tel. 847.509.9700 Fax 847.509.9798www.ipc.orgIPC-2226April 2003A standard developed by IPCCopyright Association Connecting Electro
2、nics Industries Provided by IHS under license with IPCNot for ResaleNo reproduction or networking permitted without license from IHS-,-The Principles ofStandardizationIn May 1995 the IPCs Technical Activities Executive Committee adopted Principles ofStandardization as a guiding principle of IPCs sta
3、ndardization efforts.Standards Should: Show relationship to Design for Manufacturability(DFM) and Design for the Environment (DFE) Minimize time to market Contain simple (simplified) language Just include spec information Focus on end product performance Include a feedback system on use andproblems
4、for future improvementStandards Should Not: Inhibit innovation Increase time-to-market Keep people out Increase cycle time Tell you how to make something Contain anything that cannotbe defended with dataNoticeIPC Standards and Publications are designed to serve the public interest through eliminatin
5、gmisunderstandings between manufacturers and purchasers, facilitating interchangeability andimprovement of products, and assisting the purchaser in selecting and obtaining with minimumdelay the proper product for his particular need. Existence of such Standards and Publicationsshall not in any respe
6、ct preclude any member or nonmember of IPC from manufacturing or sell-ing products not conforming to such Standards and Publication, nor shall the existence of suchStandards and Publications preclude their voluntary use by those other than IPC members,whether the standard is to be used either domest
7、ically or internationally.Recommended Standards and Publications are adopted by IPC without regard to whether theiradoption may involve patents on articles, materials, or processes. By such action, IPC doesnot assume any liability to any patent owner, nor do they assume any obligation whatever topar
8、ties adopting the Recommended Standard or Publication. Users are also wholly responsiblefor protecting themselves against all claims of liabilities for patent infringement.IPC PositionStatement onSpecificationRevision ChangeIt is the position of IPCs Technical Activities Executive Committee (TAEC) t
9、hat the use andimplementation of IPC publications is voluntary and is part of a relationship entered into bycustomer and supplier. When an IPC standard/guideline is updated and a new revision is pub-lished, it is the opinion of the TAEC that the use of the new revision as part of an existingrelation
10、ship is not automatic unless required by the contract. The TAEC recommends the useof the latest revision.Adopted October 6. 1998Why is therea charge forthis standard?Your purchase of this document contributes to the ongoing development of new and updatedindustry standards. Standards allow manufactur
11、ers, customers, and suppliers to understand oneanother better. Standards allow manufacturers greater efficiencies when they can set up theirprocesses to meet industry standards, allowing them to offer their customers lower costs.IPC spends hundreds of thousands of dollars annually to support IPCs vo
12、lunteers in thestandards development process. There are many rounds of drafts sent out for review andthe committees spend hundreds of hours in review and development. IPCs staff attends andparticipates in committee activities, typesets and circulates document drafts, and follows allnecessary procedu
13、res to qualify for ANSI approval.IPCs membership dues have been kept low to allow as many companies as possible toparticipate. Therefore, the standards revenue is necessary to complement dues revenue. Theprice schedule offers a 50% discount to IPC members. If your company buys IPC standards,why not
14、take advantage of this and the many other benefits of IPC membership as well? Formore information on membership in IPC, please visit www.ipc.org or call 847/790-5372.Thank you for your continued support.Copyright 2003. IPC, Northbrook, Illinois. All rights reserved under both international and Pan-A
15、merican copyright conventions.Anycopying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited andconstitutes infringement under the Copyright Law of the United States.Copyright Association Connecting Electronics Industrie
16、s Provided by IHS under license with IPCNot for ResaleNo reproduction or networking permitted without license from IHS-,-IPC-2226Sectional DesignStandard for HighDensity Interconnect(HDI) Printed BoardsDeveloped by the HDI Design Subcommittee (D-41) of the HDICommittee (D-40) of IPCUsers of this sta
17、ndard are encouraged to participate in thedevelopment of future revisions.Contact:IPC2215 Sanders RoadNorthbrook, Illinois60062-6135Tel 847 509.9700Fax 847 509.9798ASSOCIATION CONNECTINGELECTRONICS INDUSTRIESCopyright Association Connecting Electronics Industries Provided by IHS under license with I
18、PCNot for ResaleNo reproduction or networking permitted without license from IHS-,-This Page Intentionally Left BlankCopyright Association Connecting Electronics Industries Provided by IHS under license with IPCNot for ResaleNo reproduction or networking permitted without license from IHS-,-Acknowle
19、dgmentAny Standard involving a complex technology draws material from a vast number of sources. While the principal membersof the HDI Design Subcommittee (D-41) of the HDI Committee (D-40) are shown below, it is not possible to include allof those who assisted in the evolution of this standard. To e
20、ach of them, the members of the IPC extend their gratitude.HDICommitteeHDI DesignSubcommitteeTechnical Liaison of theIPC Board of DirectorsChairBob NevesMicrotek LaboratoriesChairLionel FullwoodWKK Distribution Ltd.Nilesh S. NaikEagle Circuits Inc.HDI Design SubcommitteeRobyn L. Aagesen, Cisco Syste
21、msInc.David R. Backen, HoneywellAdvanced CircuitsFrank Y. S. Bai, Taiwan PrintedCircuit AssociationStephen Bakke, C.I.D., AlliantTechsystems Inc.Richard W. Barry, AT&S AustriaTechnologieDavid Boggs, Intel CorporationLarry W. Burgess, LaserViaCorporationByron Case, L-3 CommunicationsWennei Chen, TRW
22、Electronics &Technology DivisionDavid J. Corbett, Defense SupplyCenter ColumbusGerhard Diehl, Alcatel SEL AGC. Don Dupriest, Lockheed MartinMissiles and Fire ControlJohn Dusl, Lockheed MartinCraig S. Fosnaugh, C.I.D., RaytheonSystems CompanyCeferino G. Gonzalez, E. I. du Pontde Nemours and Co.Michae
23、l R. Green, Lockheed MartinSpace and Strategic MissilesHue T. Green, Lockheed MartinSpace and Strategic MissilesSamy Hanna, AT&S AustriaTechnologie & SystemtechnikMike Hassebrock, Rockwell CollinsHappy T. Holden, WestwoodAssociatesMichael L. Hook, C.I.D., MotorolaSPSToru Koizumi, Fujikura Ltd.Michae
24、l G. Luke, C.I.D., RaytheonSystems CompanyRene R. Martinez, NorthropGrummanJohn C. Mather, Rockwell CollinsThad C. McMillan, Dell ComputerCorporationLei Mercado, Intel CorporationJohn H. Morton, C.I.D., LockheedMartin CorporationBenny Nilsson, Ericsson RadioSystems ABSteven M. Nolan, C.I.D.+, Silico
25、nGraphics Computer SystemThomas J. Nowak, Nowak &AssociatesDeepak K. Pai, C.I.D.+, GeneralDynamics-Advanced InformationJohn J. Quigley, Jr., Tech CircuitsInc.David Rooke, Research In MotionLimitedDaryl Sato, Intel CorporationKarl A. Sauter, Sun MicrosystemsInc.Kenneth C. Selk, TRW Electronics &Techn
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- IPC 2226 高密度 互连 HDI 印制板 设计 标准 英文